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PIC18F25K40-E/SP

  • PIC18F25K40-E/SP
  • PIC18F25K40-E/SP
PIC18F25K40-E/SP
Embedded - Microcontrollers
Microchip Technology
IC MCU 8BIT 32K
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管件
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TYPEDESCRIPTION
制造商Microchip Technology
系列PIC® XLP™ 18K
包装管件
零件状态在售
核心处理器PIC
内核规格8 位
速度64MHz
连接能力I²C,LINbus,SPI,UART/USART
外设欠压检测/复位,LVD,POR,PWM,WDT
I/O 数25
程序存储容量32KB(16K x 16)
程序存储器类型闪存
EEPROM 容量256 x 8
RAM 大小2K x 8
电压 - 供电 (Vcc/Vdd)2.3V ~ 5.5V
数据转换器A/D 35x10b; D/A 1x5b
振荡器类型内部
工作温度-40°C ~ 125°C(TA)
安装类型通孔
封装/外壳28-DIP(0.300",7.62mm)
供应商器件封装28-SPDIP
基本产品编号PIC18F25K40

Microchip Technology
IC MCU 8BIT 32KB FLASH 28SPDIP
Vishay Dale
M55342K 100PPM 0705 5.36K 0.1% R
Vishay Dale
M55342K 100PPM 0603 232 0.1% T T
Vishay Dale
M55342K 100PPM 0402 3.57K 1% T T
Samsung Electro-Mechanics
RES SMD 2.2M OHM 1% 1/16W 0402
Samsung Electro-Mechanics
RES SMD 30 OHM 5% 1/10W 0603
YAGEO
RES 2.05K OHM 0.5% 1/16W 0402
Vishay Dale
RES SMD 75K OHM 5% 1/16W 0402
YAGEO
RES 44.2 OHM 0.5% 1/10W 0603
YAGEO
RES 53.6 OHM 0.5% 1/10W 0603
YAGEO
RES 5.76K OHM 0.5% 1/10W 0603
Samsung Electro-Mechanics
RES SMD 1.69K OHM 1% 1/10W 0603
Samsung Electro-Mechanics
RES SMD 64.9K OHM 1% 1/10W 0603
Samsung Electro-Mechanics
RES SMD 1.62K OHM 1% 1/10W 0603
Samsung Electro-Mechanics
RES SMD 4.3K OHM 1% 1/10W 0603
Samsung Electro-Mechanics
RES SMD 82K OHM 1% 1/10W 0603
Samsung Electro-Mechanics
RES SMD 95.3K OHM 1% 1/10W 0603
Samsung Electro-Mechanics
RES 2.61 OHM 1% 1/10W 0603
Samsung Electro-Mechanics
RES 453 OHM 1% 1/10W 0603
Samsung Electro-Mechanics
RES 61.9 OHM 1% 1/10W 0603
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